This repository contains the design files for the revision.1 of the OhmTech's uThing::VOC USB dongle.
The PCB is layered out in a 4-layer FR4 board.
Below is a list of the requirements for the fabrication technology:
- Number of Layers: 4
- Total board thickness: 1.55 mm
- Legend (silkscreen): White. Top and Bottom
- Base material: FR4
- Smallest via: >= 0.25 mm
- Outer layer isolation distance ﴾OL‐TT‐TP‐PP: 0.150 mm (6 mil)
- Outer layer track-width ﴾IL‐TW﴿: 0.150 mm (6 mil)
- Inner layer isolation distance ﴾IL‐TT‐TP‐PP: 0.150 mm (6 mil)
- Inner layer track-width ﴾IL‐TW﴿: 0.150 mm (6 mil)
- Board buildup: Standard, no special requirement
- Inner layer copper foil: 35 um
- Outer layer copper foil: 18 um
- Surface finish: any lead-free finish
The PCB Outer dimensions are 30x14.5 mm, with the USB-A connector installed the final dimension is approx. 48x15x5 mm.
Gerber BOM and Pick&Place files are provided for PCB manufacturing and assembly.
- The Firmware source code can be found here: https://github.com/ohmtech-io/uThingVOC.git
- The assembled boards can be obtained at the Tindie store: https://www.tindie.com/products/damancuso/uthingvoc/
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License
Copyright (c) 2019 Daniel Mancuso - OhmTech.io
This work is licensed under a Creative Commons Attribution-ShareAlike 4.0 International License.
