Skip to content
New issue

Have a question about this project? Sign up for a free GitHub account to open an issue and contact its maintainers and the community.

By clicking “Sign up for GitHub”, you agree to our terms of service and privacy statement. We’ll occasionally send you account related emails.

Already on GitHub? Sign in to your account

Update Bender.yml #62

Merged
merged 1 commit into from
Oct 14, 2024
Merged

Conversation

Konste11ation
Copy link

@Konste11ation Konste11ation commented Oct 11, 2024

This PR adds the new tsmc module under tsmc_pad target

Copy link

@rgantonio rgantonio left a comment

Choose a reason for hiding this comment

The reason will be displayed to describe this comment to others. Learn more.

Naisu! Thanks!

@Konste11ation Konste11ation merged commit c16c8d1 into chip_antwerp Oct 14, 2024
2 checks passed
@Konste11ation Konste11ation deleted the fanchen/add-bender-tsms-pad branch October 14, 2024 07:55
IveanEx pushed a commit that referenced this pull request Nov 2, 2024
@IveanEx IveanEx mentioned this pull request Nov 2, 2024
IveanEx added a commit that referenced this pull request Nov 2, 2024
* Update Bender.yml (#62)

* Update occamy_chip.sv.tpl (#63)

* Update SPI Testbench to support multiple read / write demands (#64)

* fix chip connection (#65)

* Fix Chip Connection

* Update HeMAiA FPGA Config

---------

Co-authored-by: Fanchen Kong <100082872+Konste11ation@users.noreply.github.com>
Sign up for free to join this conversation on GitHub. Already have an account? Sign in to comment
Labels
None yet
Projects
None yet
Development

Successfully merging this pull request may close these issues.

2 participants