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Releases: renesas/fsp

v1.2.0

30 Jun 16:49
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 1.2.0.

Download the FSP with e2 studio Installer for this release, setup_fsp_v1_2_0_e2s_v2020-04.exe, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v1_2_0_rasc_v2020-04.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

e2 studio : 2020-04

GCC Compiler : 9-2019-q4-major

IAR Compiler : 8.50.1

ARM Compiler : 6.14

QE for Capacitive Touch : 1.1.0

QE for BLE : 1.0.0 *Refer to Known Issues section if using this tool

Features Added

  • PDC driver (r_pdc) now available
  • SEGGER emWin updated to v6.14a
  • Arm Compiler used for development and testing updated to v6.14
  • Arm CMSIS updated to v5.7.0
  • The PSA Crypto ECDH implementation on RA6 devices was updated to utilize hardware acceleration resulting in significantly better performance

Third Party Software

These third party software solutions are included alongside FSP.

FreeRTOS: 202002.00

Arm CMSIS5: 5.7.0

Arm Mbed Crypto: 3.1.0+renesas.1

Arm Mbed TLS: 3.0.0p1

Arm littlefs: 2.2.1

FreeRTOS+FAT: 160919a

SEGGER emWin: 6.14a

SEGGER J-Link: 6.80c

TES D/AVE 2D: 3.8.0

Bug Fixes

  • Fixes register settings that now allow user to provide external high-potential reference voltage (VREFH0) for ADC16 on the RA2A1.
  • Removed the "Name" property for rm_wifi_onchip_silex in the configurator since the instance is global.
  • Fixed issue in DAC8 module where channel 1 was clearing the incorrect bit in MSTPCRD.
  • Parameter checking can now be enabled in RM_LITTLEFS_FLASH.
  • Fixed mask/check for available OPAMP channel on RA4W1.
  • Resolves CAN baud rate specific enum IAR warnings and fixes the range parameter check for prescalar value
  • Calling R_ADC_InfoGet() on a RA6M1 device would incorrectly read data from a MCU address that could cause Flash API issues if a flash operation was on-going.
  • USB suspend operation in host mode was not supported.
  • emWin JPEG input streaming issue fixed for 8-byte aligned mode.
  • SweynTooth vulnerability fix added to BLE library.
  • USB HMSC updated to improve performance.

Known Issues

  • Issue
    The QE for BLE tool v1.0.0 does not support e2 studio version 2020-04 or newer. The platform installer for this release will install e2 studio 2020-04.
    Workaround
    Applications that need to use the QE for BLE tool must use e2 studio v7.8 which can be downloaded from a previous FSP release. FSP v1.2.0 can be installed into e2 studio v7.8 using the packs, or standalone pack installer, that can be found in the Assets section of this release.
  • Issue
    When long file name (LFN) and Unicode UTF16 Support in FreeRTOS + FAT configuration is enabled, build error is thrown by the compiler.
  • Issue
    USB PMSC Driver does not return an error when the user tries to write data to a locked SD Card.
  • Issue
    The USB driver does not work properly when the USB interrupt priority level is higher priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
    Workaround
    Specify a lower priority for the USB interrupt priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
  • Issue
    When creating services for a custom profile in the R_BLE Custom Profile RA (QE) View, if you create multiple services with the same UUID or the same abbreviation, the GUI may behave incorrectly.
    Workaround
    Do not use duplicate UUIDs or abbreviation.

Breaking Changes

  • Issue
    The aws_clientcredential.h file is now generated by default. This can lead to multiple instances of the file if migrating from a previous FSP version where the file was created manually. Include path ordering will dictate which file gets chosen.
    Workaround
    The new AWS Client Credentials module has an option in its Properties to include a header file. Rename the existing aws_clientcredential.h header file in the project and then add its new name to the Properties for AWS Client Credentials.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

  • FSP_Packs_v1.2.0.zip 94e64c02a666499976b14a0e47d220e4
  • FSP_Packs_v1.2.0.exe 371ca13f358092b650c8b968dfdab246
  • fsp_documentation_v1.2.0.zip 23ea1a7afc57ed00973c1949163b1280
  • setup_fsp_v1_2_0_e2s_v2020-04.exe 05c0b922346979874d57497d2cfe3576
  • setup_fsp_v1_2_0_rasc_v2020-04.exe df94b4c3f442753fe73840a60821a6c6

v1.1.1

29 May 16:42
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 1.1.1.

This release includes packs that are installed separately from e2 studio. This means the v1.1.0 platform installer should be installed first. Then the packs for this release can be installed into the new e2 studio.

The packs, and a standalone pack installer, are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Bug Fixes

  • USB basic parameter checking could not be properly enabled.
  • BLE did not support timeout feature of RM_BLE_ABS_StartScanning().
  • It was not documented that USB HHID did not work on the USBHS peripheral of the RA6M3.
  • Removed AC6 compiler warning when build r_sci_uart generated code.
  • The ELC module instance name in e2 studio is now shown as being fixed in e2 studio.
  • The Ethernet PHY target source files were given unique names to resolve an issue with using IAR Embedded Workbench.
  • Fixed an issue causing multiple copies of mbedtls/error.h being added to a project which could cause a build error.

MD5 Checksums

  • FSP_Packs_v1.1.1.zip b05d78d21c668c6385ba412bf4d411f2
  • FSP_Packs_v1.1.1.exe 85818473d0b2dd126cc375b5ff72a613
  • fsp_documentation_v1.1.1.zip 2f147523b38ce8c721870f5765fc70e3

v1.1.0

07 May 02:10
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 1.1.0.

Download the FSP with e2 studio Installer for this release, setup_fsp_v1_1_0_e2s_v7_8_0.exe, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v1_1_0_rasc_v2020-04.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler : 9-2019-q4-major

IAR Compiler: 8.50.1

ARM Compiler : 6.13

QE for Capacitive Touch : 1.1.0

QE for BLE : 1.0.0

Features Added

  • RA4W1 MCU support
  • Bluetooth Low Energy (rm_ble_abs)
  • USB Host HID Class (r_usb_hhid)
  • USB Peripheral HID Class (r_usb_phid)
  • SEGGER emWin can be used without RTOS
  • SEGGER emWin now supports 8bpp and 4bpp modes
  • E2 and E2 Lite emulator support
  • LittleFS now available as key storage for AWS PKCS11 PAL

Third Party Software

These third party software solutions are included alongside FSP.

FreeRTOS: 202002.00

Arm CMSIS5: 5.6.0

Arm Mbed Crypto: 3.1.0+renesas.1

Arm Mbed TLS: 3.0.0p1

Arm littlefs: 2.2.1

FreeRTOS+FAT: 160919a

SEGGER emWin: 6.10f

SEGGER J-Link: 6.70e

TES D/AVE 2D: 3.8.0

Bug Fixes

  • Register protection was not disabled when writing the VBTCR1 register in the BSP.
  • Fixed possible #include ordering issue with rm_wifi_onchip_silex
  • LittleFS default block count is now a function of data flash size. Default block size remains at 128 bytes as the minimum block size for LittleFS is 104 bytes.
  • Added support for using LittleFS under AWS PKCS11 PAL for key storage.
  • Fixed an issue causing mbedtls_utils.c from being included in the AWS pack. This file contains functions required for key provisioning.
  • Fixed issues with horizontal stride setting for GLCDC and emWin
  • RA Configuration editor now generates correct configuration for COMPSEL0 and does not overwrite register setting for ACMPLP.
  • In the RA Configuration editor, the ADC module displayed an error if a callback was provided in continuous mode. This has been removed.
  • There were build errors when adding AGT without using BLE. AGT will now build under both scenarios.
  • The QSPI documentation stated that SEGGER J-Link supported programming QSPI chips on Port 5 when it is actually Port 3.
  • Mbed Crypto can now be brought into RA4 and RA2 projects using the RA Configuration editor.

Known Issues

  • Issue
    USB basic parameter checking cannot be enabled.
  • Issue
    The USB driver does not work properly when the USB interrupt priority level is higher priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
    Workaround
    Specify a lower priority for the USB interrupt priority than the configMAX_SYSCALL_INTERRUPT_PRIORITY macro value.
  • Issue
    BLE software does not support timeout feature of RM_BLE_ABS_StartScanning().
    Workaround
    Set a timer on your own for your scan duration.
  • Issue
    USB HHID module on the RA6M3 does not work on the USBHS peripheral in this release.
    Workaround
    Use USBFS for USB HHID.
  • Issue
    USB suspend operation in host mode is not supported.
  • Issue
    When creating services for a custom profile in the R_BLE Custom Profile RA (QE) View, if you create multiple services with the same UUID or the same abbreviation, the GUI may behave incorrectly.
    Workaround
    Do not use duplicate UUIDs or abbreviations.
  • Issue
    There may be build errors when using Mbed TLS and Mbed Crypto in a project. For example, when using Secure Sockets on WiFi or Ethernet. This is due to an include path ordering issue.
    Workaround
    Change the order of the include paths for your project such that the include for "ra/arm/mbedtls/include" is after the include for "ra/arm/mbed-crypto/include".

MD5 Checksums

  • FSP_Packs_v1.1.0.zip 5c3c7f44ee825d502e336fb56ad8a77e
  • FSP_Packs_v1.1.0.exe 1081e0d5d5e1d32f7de011c8b6d94b30
  • fsp_documentation_v1.1.0.zip 0461fe97bfb45497bb973eb74e6e135e
  • setup_fsp_v1_1_0_e2s_v7_8_0.exe c7fe802b8d54cb3f91277b7afc5094c3
  • setup_fsp_v1_1_0_rasc_v2020-04.exe e51b64d292605e3375d5bf731ce29ff5

v1.0.0

30 Mar 17:46
d0ed16c
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 1.0.0.

Download the FSP with e2 studio Installer for this release, setup_fsp_v1_0_0_e2s_v7_8_0.exe, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v1_0_0_rasc_v7_8_0.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

GCC Compiler : 9-2019-q4-major

IAR Compiler: 8.50.1

ARM Compiler : 6.13

Features Added

  • Controller Area Network (r_can)
  • Digital to Analog Converter (r_dac8)
  • Interrupt skipping in r_gpt
  • Three Phase General PWM Timer (r_gpt_three_phase)
  • Port Output Enable for GPT (r_poeg)
  • Quad Serial Peripheral Interface Flash (r_qspi)
  • Sigma Delta Analog to Digital Converter (r_sdadc)
  • Segment LCD Controller (r_slcdc)
  • USB Host CDC Class (r_usb_hcdc)
  • USB Peripheral Mass Storage Class (r_usb_pmsc)
  • SD/MMC Block Media Implementation (rm_block_media_sdmmc)
  • USB Host MSC Block Media Implementation (rm_block_media_usb)
  • Wifi Middleware (rm_wifi_onchip_silex)
  • Wrapped key support in Mbed Crypto
  • ECC 384 Hardware Acceleration Support
  • TLS support using FreeRTOS Secure Sockets for WiFi and Ethernet
  • CMSIS Neural Network
  • Arm littlefs file system now available for use on data flash
  • Temperature compensation and noise immunity add to r_ctsu
  • C++ projects will build for GCC and IAR
  • Added support for configuring the USB clock source on the RA4 series MCUs
  • FreeRTOS MQTT Support
  • Standalone FSP installer for Windows is now created and included in release
  • emWin AppWizard support now available
  • General call now supported on r_iic_slave

Third Party Software

FreeRTOS: 202002.00

Arm CMSIS5: 5.6.0

Arm Mbed Crypto: 3.1.0+renesas.1

Arm Mbed TLS: 3.0.0p1

Arm littlefs: 2.1.4

FreeRTOS+FAT: 160919a

SEGGER emWin: 6.10f

SEGGER J-Link: 6.64b

TES D/AVE 2D: 3.8.0

Features Modified

  • Analog to Digital Converter (r_adc)
  • Capacitive Touch Sensing Unit (r_ctsu)
  • Digital to Analog Converter (r_dac)
  • Direct Memory Access Controller (r_dmac). e2 studio configuration only
  • General PWM Timer (r_gpt)
  • JPEG Codec (r_jpeg). Encode support added
  • Key Interrupt (r_kint). e2 studio configuration only
  • Low Power Modes (r_lpm)
  • Realtime Clock (r_rtc)
  • Serial Communications Interface (SCI) I2C (r_sci_i2c)
  • SD/MMC Host Interface (r_sdhi)
  • SEGGER emWin Port (rm_emwin_port)
  • Crypto Middleware (rm_psa_crypto)
  • Capacitive Touch Middleware (rm_touch)
  • FreeRTOS version updated
  • Mbed Crypto version updated
  • FreeRTOS+FAT. New architecture. Now supports USB and SDHI
  • USB DMA support added
  • Documentation links on modules in e2studio now point to locally installed documentation
  • USB (r_usb_basic) has compatibility breaking API changes
  • USB Host Mass Storage Class Driver (r_usb_hmsc) has compatibility breaking API changes
  • USB Peripheral Communication Device Class (r_usb_pcdc) has compatibility breaking API changes
  • 2nd argument of R_ETHER_Read() is changed from "void ** const pp_buffer" to "void * const p_buffer"

Features Removed

None

Bug Fixes

  • The r_sdhi module was not able to properly set the activation event for the r_dmac module when r_dmac was chosen as its dependency.
  • The BSP for RA2 parts did not fully follow the flow chart for turning off the TRNG out of reset.
  • The interrupts in r_sci_i2c were not populated correctly in the generated i2c_master_cfg_t structure.
  • The LPM snooze cancel source was not available in the configuration tool, and the enumeration options were incorrect for RA4 and RA2 devices.
  • R_RTC_PeriodicIrqRateSet could cause the application to hang.
  • Multiple selections are available for LPM wake sources, GPT input sources, ADC channels, and KINT channels. These properties are not backward compatible and must be reconfigured.
  • The period calculation for r_gpt and r_agt could generate build errors for some configurations.
  • The KSZ8091RNB PHY initialization code for for the EK-RA6M3 incorrectly configured the PHY for 50MHz mode when it should have been 25MHz.
  • The ADC was not functional on RA6M1 because the PGA was not initialized.
  • Added missing externs to generated SPI structure header.
  • The Activation Source property in the XML for r_dtc was a text field instead of a list. This could cause build errors if the text did not match a vector in the system.
  • Fixed an issue where Snooze mode was not being enabled correctly on RA2 devices.
  • In bsp_clock_init, R_BSP_SoftwareDelay() was being called before SystemCoreClockUpdate(). This had undefined behavior if sub-clock was chosen as the source clock in the BSP.
  • For GCC projects, both malloc and the FreeRTOS memory allocation prvPortMalloc allocate memory from the same memory pool. Existing GCC projects need to update the linker script so that __HeapBase is defined at the start of g_heap (from startup.o).
  • The transfer_info::irq setting was previously hard coded to TRANSFER_IRQ_EACH for DMAC. transfer_info_t::irq setting can now be configured for TRANSFER_IRQ_EACH, or TRANSFER_IRQ_END.
  • The Activation Source property in the XML for r_dtc was a text field instead of a list. This could cause build errors if the text did not match a vector in the system.
  • Configuration ID changed for GPT "Duty Cycle Range" configuration (not backwards compatible).
  • Writes to FIFO transmit register are updated in the driver implementation to fix the UART write failure on RA2A1 with FIFO enabled.
  • Added data flash enable for LP devices to R_BSP_WarmStart. Data flash will now only be enabled in the r_flash_lp module if it was not already enabled previously.
  • Fixed issue with improper generation of parameter checking macro for rm_wifi_onchip_silex.
  • When configuring the VREF pins on RA4M1, the pin configuration showed errors and the generated pin data was incorrect.
  • FreeRTOS was using BSP_CFG_IRQ_MASK_LEVEL_FOR_CRITICAL_SECTION to set basepri in vPortEnterCritical. It has been changed to use configLIBRARY_MAX_SYSCALL_INTERRUPT_PRIORITY.
  • The "MCU Vcc (mV)" option in the BSP properties would not allow a VCC entry larger than 4.6V. This has been fixed to allow up to 5.5V.
  • When using the AC6 compiler, heap size is configured using Heap Size on the BSP tab instead of in the <mcu>.scat scatter file. Existing projects must update the scatter file to use this change.

Known Issues

  • Issue
    When provisioning the device using the AWS-provided vAlternateKeyProvisioning(), a build error will occur because of a missing function.
    Workaround
    Download mbedtls_util.c and add the file to your application build.
  • Issue
    The AWS Device Provisioning code writes directly to data flash. The Mbed Crypto persistent storage littlefs module also writes to data flash. Using both of these features in the same project will cause data corruption.
    Workaround
    Modify rm_littlefs_flash_cfg.h to add a new definition "#define RM_LITTLEFS_FLASH_DATA_START" and define it to a sufficient offset such that there is enough space for the AWS Device Provisioning credentials at the beginning of data flash. For example, a RSA2048 private key and a certificate in PEM format takes up about 1700 and 1100 bytes respectively. It is also necessary to change the "block count" value in "LittleFS on Flash" module to reflect the reduced data flash size that can be utilized by littlefs.
  • Issue
    The default values for the "LittleFS on Flash" needs to be modified. The default value for "Block Size (bytes)" is 128 when it should be 64 bytes. The default value of "Block Count" is 1024 which will vary depending on the MCU being used.
    Workaround
    In the module properties for "LittleFS on Flash" change "Block Size (bytes)" to 64. Also, change "Block Count" such that Block Size multiplied by Block Count is the size of the data flash on the MCU.

Knowledge Base

Visit our knowledge base for other technical updates.

Checksums

  • FSP_Packs_v1.0.0.exe 0188b4d3de034c8b1e1ad6aa2384119c
  • setup_fsp_v1_0_0_e2s_v7_8_0.exe c688640ab4799223d9c2106cc7f05600
  • setup_fsp_v1_0_0_rasc_v7_8_0.exe 6e1422d50b17e1b3147caea275e74f9b

v0.8.0

07 Oct 04:23
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Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 0.8.0.

Download the FSP with e² studio Installer for this release from here. This is also available in the Assets section of this release (setup_fspv0_8_0_e2s_v7_6_0.exe).

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

e2 studio: e2 studio v7.6.0

GCC Compiler : 8-2019-q3-update

ARM Compiler : 6.12

Modules Added

  • Board Support Package (bsp)
  • High-Speed Analog Comparator (r_acmphs)
  • Low-Power Analog Comparator (r_acmplp)
  • Analog to Digital Converter (r_adc)
  • Asynchronous General Purpose Timer (r_agt)
  • Clock Frequency Accuracy Measurement Circuit (r_cac)
  • Clock Generation Circuit (r_cgc)
  • Cyclic Redundancy Check (CRC) Calculator (r_crc)
  • Capacitive Touch Sensing Unit (r_ctsu)
  • Digial to Analog Converter (r_dac)
  • Direct Memory Access Controller (r_dmac)
  • Data Operation Circuit (r_doc)
  • D/AVE 2D Port Interface (r_drw)
  • Data Transfer Controller (r_dtc)
  • Event Link Controller (r_elc)
  • Ethernet (r_ether)
  • Ethernet PHY (r_ether_phy)
  • High-Performance Flash Memory (r_flash_hp)
  • Low-Power Flash Memory (r_flash_lp)
  • Graphics LCD Controller (r_glcdc)
  • General PWM Timer (r_gpt)
  • Interrupt Controller Unit (r_icu)
  • I2C Master on IIC (r_iic_master)
  • I2C Slave on IIC (r_iic_slave)
  • I/O Ports (r_ioport)
  • Independent Watchdog Timer (r_iwdt)
  • JPEG Codec (r_jpeg)
  • Key Interrupt (r_kint)
  • Low Power Modes (r_lpm)
  • Low Voltage Detection (r_lvd)
  • Realtime Clock (r_rtc)
  • Serial Communications Interface (SCI) I2C (r_sci_i2c)
  • Serial Communications Interface (SCI) SPI (r_sci_spi)
  • Serial Communications Interface (SCI) SPI (r_sci_uart)
  • SD/MMC Host Interface (r_sdhi)
  • Serial Peripheral Interface (r_spi)
  • Serial Sound Interface (r_ssi)
  • Universal Serial Bus (r_usb_basic)
  • Universal Serial Bus Host Mass Storage Class (r_usb_hmsc)
  • Universal Serial Bus Peripheral Communication Device Class (r_usb_pcdc)
  • Watchdog Timer (r_wdt)
  • SEGGER emWin Port (rm_emwin_port)
  • Amazon FreeRTOS Port (rm_freertos_port)
  • Crypto Middleware (rm_psa_crypto)
  • Capacitive Touch Middleware (rm_touch)

Third Party Software

Amazon FreeRTOS: 201906.00_Major

Arm CMSIS5: 5.5.1

Arm Mbed Crypto: 1.1.0

FreeRTOS+FAT: 160919a

SEGGER emWin: 5.50.f

TES D/AVE 2D: 3.8.0

Modules Modified

None

Modules Removed

None

Known Issues

  • Issue
    When using the AC6 compiler, modifying the Heap Size on the BSP tab of the configuration tool has no effect.
    Workaround
    Update the heap size in the ARM_LIB_STACKHEAP section of the linker scatter file .scat.
  • Issue
    GPT configurations in the Input section of the RA configuration tool should support multiple selections, but currently only support a single selection.
    Workaround
    Copy and modify the generated gpt_extended_cfg_t to select as many sources as required by the application. Copy and modify the generated timer_cfg_t to point to the modified gpt_extended_cfg_t.
  • Issue
    When more than one touch instances are used, data for the second instance is not displayed correctly by the monitoring feature of the QE tool.
    Workaround
    Do not use the QE tool to monitor more than one instances.